A Fully-integrated Ku/K Broadband Amplifier MMIC Employing a Novel Chip Size Package

YUN, Young

Journal of Navigation and Port Research 2003;27(2):217-221.
Published online June 30, 2003.

새로운 형태의 CSP를 이용한 완전 집적화 Ku/K밴드 광대역 증폭기 MMIC

윤영

A Fully-integrated Ku/K Broadband Amplifier MMIC Employing a Novel Chip Size Package

Young YUN

Abstract

In this work, we used a novel RF-CSP to develop a broadband amplifier MMIC, including all the matching and biasing comporents, for Ku and K band applications. By utilizing an ACF for the RF-CSP, the fabrication process for the packaged amplifier MMIC could be simplified and made cost effective. STO (SrTiO3) capacitors were employed to integrate the DC biasing components on the MMIC. A pre-matching technique was used for the gate input and drain output of the FETs to achieve a broadband design for the amplifier MMIC. The amplifier CSP MMIC exhibited good RF performance (Gain of 12.5±1.5 ㏈, return loss less than -6 ㏈, P1㏈ of 18.5±1.5 ㏈m) over a wide frequency range. This work is the first report of a fully integrated CSP amplifier MMIC successfully operating in the Ku/K band.

Key Words: broadband amplifier;MMIC;chip size package;ACF;STO